package board
英 [ˈpækɪdʒ bɔːd]
美 [ˈpækɪdʒ bɔːrd]
网络 插件板
双语例句
- Ply change is big, board face has bongo package, water proofing property of demonstrative board face is poor.
厚度变化大，板面有小鼓包，说明板面防水性差。 - The utility model comprises a surface board provided with a plurality of package boards in variable positions on the surface, a component mounting board and a mounting bracket for printing boards.
组合件由表面装有数种可变位置的独立组件板的面板、元件安装板和印板安装架组成。 - LCD ′ s Cushioning Package Design with Corrugated Board
液晶显示器的全瓦楞纸板缓冲包装设计 - We are awaiting your instructions regarding labeling to each package for shipment on board m.v. Red Star.
我方正详待贵方有关装红星号船外包装标签的指示。 - Single amplifiers are available in SOT-23 packages and duals in a10 Ld MSOP package for applications where board space is critical.
单放大器提供SOT-23封装，并在10引脚MSOP封装的应用电路板空间是至关重要的对偶。 - General speaking, It has three significant steps of innovation: first is the translation to surface mounting package from through hole package in the end of last eighties, it significantly increase the density of printed wire board;
总体说来，它大概有三次重大的革新：第一次是在上世纪80年代从引脚插入式封装到表面贴片封装，极大地提高了印刷电路板上的组装密度； - We also built an embedded system environment with graphical interface by porting Nucleus OS and its graphics package onto Linkup 7210 system developing board.
接着，我们通过将Nucleus操作系统及其图形包移植到Linkup7210开发板上，搭建起一个支持图形界面的嵌入式系统研究环境。 - The article introduces integrated technical process in assembling radar package board through three ways of prophase preparation, process planning and quality control.
本文通过前期准备、工艺设计、质量控制三个方面介绍了雷达组件板组装的整个工艺过程； - Improving the LSA software package and completing the experiment of measuring the standard-particles board by using the new laser particle size measuring system.
在原软件基础上编制了USB总线下的激光粒度测试软件LSA，并使用新的激光粒度测试系统完成了对标准粒子板的测试实验，得到了满意的结果。 - The package construction, process flow, and package reliability are described, together with board level assembly processes and interconnect reliability.
论述了封装结构、工艺流程及封装可靠性，并阐述了板级组装工艺过程和互连可靠性。 - This design model takes use of the hardware Bard Support Package ( BSP) to support the transplanting in sorts of OEM board or hardware system board, therefore solves the questions in traditional system, and last meets the current need for ERTOS.
该设计模型引入硬件板级支持软件包（BSP）来支持操作系统在各类OEM板或用户定制硬件系统板上的移植，从而解决了传统系统的缺陷，满足了当前对ERTOS的需求。 - With the same temperature on package, solder ball and PCB board, thermal cycling simulation ignores the thermal gradients in the whole assembly.
热循环模拟是在封装、焊球和PCB基板的任一节点上施加相同的温度载荷，忽略了整个封装体内温度梯度的存在。 - The Assembly Craft of Package Board in Radar
雷达组件板的组装工艺 - In addition, the software frame of MPACS terminal is discussed in details, and the software structure principle and realization of MPACS terminal is introduced from three parts: BSP ( board support package) level, operating system level and application software level of MPACS terminal.
然后详细讨论了MPACS终端的软件架构，并分BSP（BoardSupportPackage）层、操作系统层、MPACS终端应用软件层三个部分详细介绍了MPACS终端的软件构成原理与实现方法； - Integrated Package Technique of Multilayer Wiring on Silicon Based Board
硅基多层布线集成组装技术 - Currently in the semiconductor packaging process, the die chip connect with Lead frame pin by the chip interconnect to achieve the one step package, and after Trim/ Form chip connect with the substrate ( PCB board) by the soldering process.
目前在半导体封装制程中，裸芯片通过芯片互连方法将其焊区与封装外引脚连接起来完成一级封装，经切筋成型后通过焊接工艺与基板（PCB板）连接。